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- 22articles · 30d
- 11+ hour agolatest article
- Aug 18, 2026earliest in window
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- 262avg words
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- Computers & Electronics 16
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News
AI Data Centers Move Toward 800 VDC: How SiC Circuit Protection Could Reshape the Semiconductor Supply Chain
11+ hour, 6+ min ago (185+ words) tspasemiconductor.substack.com AI Data Centers Move Toward 800 VDC: How SiC Circuit Protection Could Reshape the Semiconductor Supply Chain Original Article By SemiVision Research [Reading time: 10 mins] The competition in AI infrastructure reaches beyond the accelerator. When a facility has limited…...
My First Trip to Jakarta Took Me to a Very “Heavy” Trade Show: What I Learned About Indonesia’s Energy and Engineering Economy
1+ day, 5+ hour ago (1505+ words) This trip to Jakarta was somewhat spontaneous. A friend’s company happened to be exhibiting here, and I had never been to Jakarta before. So I thought: why not come over, visit my friend, see the city for the first time,…...
The Semiconductorization of PCB Equipment: From Precision Drilling to CPO Inspection in the AI Era
5+ day, 11+ hour ago (194+ words) semivision The Semiconductorization of PCB Equipment: From Precision Drilling to CPO Inspection in the AI Era From PCB Drilling and Precision Optical Processing to CPO AOI As AI server platforms continue to evolve toward higher computing performance, the growth drivers…...
China’s Critical-Materials Pressure Test on Taiwan: The Next Tech War May Start at Customs, Not at the Fab
5+ day, 11+ hour ago (852+ words) For years, the semiconductor industry has focused on export controls at the top of the technology stack: EUV lithography, advanced GPUs, EDA software, high-bandwidth memory, and leading-edge process technology. The next phase of the technology war may look very different....
Beyond Moore’s Law: The Rise of AI System Scaling ：SEMICON Taiwan 2026 — From Advanced Packaging and CPO to Memory, Test, and Thermal Innovation
5+ day, 23+ hour ago (357+ words) AI Semiconductors Enter the System Scaling Era: Advanced Packaging, CPO, HBM, FOPLP, and Testing Emerge as the Next Key Battlegrounds Based on SemiVision’s observations from the technical forums, industry discussions, and exhibition floor at SEMICON Taiwan 2026, the most important industry…...
From One GPU to an AI Factory: Deep Dive into NVIDIA’s Six Hot Chips 2026 Presentations
6+ day, 10+ hour ago (433+ words) If NVIDIA’s message at Hot Chips 2026 had to be summarized in one sentence, it would be this: the next phase of competition is no longer about who has the fastest GPU. It is about who can combine compute, memory, networking,…...
TSMC COUPE Is Evolving: From a Silicon Photonics Engine to an Active Photonics Integration Platform
1+ week, 9+ hour ago (25+ words) semivision Continue reading this post for free, courtesy of SEMIVISION....
When AI Chips Depend on a Bottle of Gas: How WF₆ Is Emerging as a New Bottleneck
1+ week, 1+ day ago (175+ words) semivision When AI Chips Depend on a Bottle of Gas: How WF₆ Is Emerging as a New Bottleneck Oroginal Article By SemiVision Research [Reading time: 10 mins] The semiconductor supply constraints created by the AI boom are moving progressively upstream. Over the…...
Hot Chips 2026: HBM Base Die Evolves from a Memory Interface into a Computing Engine — Samsung Unveils a Three-Phase Roadmap Toward Custom HBM, aHBM, and zHBM
1+ week, 1+ day ago (326+ words) The AI era, however, is beginning to rewrite this division of responsibilities. The central idea Samsung introduced at Hot Chips 2026 is to apply advanced logic processes to the HBM Base Die, transforming the B-die from what has historically been a…...
Canada plugs into Taiwan’s chip machine - From Design to Delivery
1+ week, 6+ day ago (1406+ words) The next phase of the semiconductor race will be less about copying fabs than about connecting talent, tools and specialised technologies Thank you, TechSoda Research for the invitation. It was a very well-organized and insightful event! For most countries, industrial…...