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- 22articles · 30d
- 11+ hour agolatest article
- Aug 18, 2026earliest in window
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- 262avg words
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News
Hot Chips 2026: HBM Base Die Evolves from a Memory Interface into a Computing Engine — Samsung Unveils a Three-Phase Roadmap Toward Custom HBM, aHBM, and zHBM
1+ week, 1+ day ago (326+ words) The AI era, however, is beginning to rewrite this division of responsibilities. The central idea Samsung introduced at Hot Chips 2026 is to apply advanced logic processes to the HBM Base Die, transforming the B-die from what has historically been a…...
Canada plugs into Taiwan’s chip machine - From Design to Delivery
1+ week, 6+ day ago (1406+ words) The next phase of the semiconductor race will be less about copying fabs than about connecting talent, tools and specialised technologies Thank you, TechSoda Research for the invitation. It was a very well-organized and insightful event! For most countries, industrial…...
SK hynix Breaks Ground in Indiana: HBM’s Second Competitive Curve Is Supply-Chain Localization
2+ week, 10+ hour ago (223+ words) The first “Made in USA” HBM will still begin with wafers fabricated in Korea. That is not a contradiction. It is a preview of how the AI semiconductor supply chain is being redesigned. The AI semiconductor boom is usually discussed…...
HBF: As NAND Adopts an HBM-Like Architecture, the AI Memory Hierarchy Is Being Redefined
3+ week, 9+ hour ago (211+ words) A new direction is emerging in AI infrastructure in 2026: NAND flash is no longer being treated solely as storage inside SSDs. Instead, it is beginning to evolve toward a near-compute, high-bandwidth, high-capacity memory tier. One of the most representative technologies…...