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- 22articles · 30d
- 11+ hour agolatest article
- Aug 18, 2026earliest in window
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News
AI Data Centers Move Toward 800 VDC: How SiC Circuit Protection Could Reshape the Semiconductor Supply Chain
11+ hour, 6+ min ago (185+ words) tspasemiconductor.substack.com AI Data Centers Move Toward 800 VDC: How SiC Circuit Protection Could Reshape the Semiconductor Supply Chain Original Article By SemiVision Research [Reading time: 10 mins] The competition in AI infrastructure reaches beyond the accelerator. When a facility has limited…...
Beyond Moore’s Law: The Rise of AI System Scaling ：SEMICON Taiwan 2026 — From Advanced Packaging and CPO to Memory, Test, and Thermal Innovation
5+ day, 23+ hour ago (357+ words) AI Semiconductors Enter the System Scaling Era: Advanced Packaging, CPO, HBM, FOPLP, and Testing Emerge as the Next Key Battlegrounds Based on SemiVision’s observations from the technical forums, industry discussions, and exhibition floor at SEMICON Taiwan 2026, the most important industry…...
From One GPU to an AI Factory: Deep Dive into NVIDIA’s Six Hot Chips 2026 Presentations
6+ day, 10+ hour ago (433+ words) If NVIDIA’s message at Hot Chips 2026 had to be summarized in one sentence, it would be this: the next phase of competition is no longer about who has the fastest GPU. It is about who can combine compute, memory, networking,…...
When AI Chips Depend on a Bottle of Gas: How WF₆ Is Emerging as a New Bottleneck
1+ week, 1+ day ago (175+ words) semivision When AI Chips Depend on a Bottle of Gas: How WF₆ Is Emerging as a New Bottleneck Oroginal Article By SemiVision Research [Reading time: 10 mins] The semiconductor supply constraints created by the AI boom are moving progressively upstream. Over the…...
Hot Chips 2026: HBM Base Die Evolves from a Memory Interface into a Computing Engine — Samsung Unveils a Three-Phase Roadmap Toward Custom HBM, aHBM, and zHBM
1+ week, 1+ day ago (326+ words) The AI era, however, is beginning to rewrite this division of responsibilities. The central idea Samsung introduced at Hot Chips 2026 is to apply advanced logic processes to the HBM Base Die, transforming the B-die from what has historically been a…...
Canada plugs into Taiwan’s chip machine - From Design to Delivery
1+ week, 6+ day ago (1406+ words) The next phase of the semiconductor race will be less about copying fabs than about connecting talent, tools and specialised technologies Thank you, TechSoda Research for the invitation. It was a very well-organized and insightful event! For most countries, industrial…...
SK hynix Breaks Ground in Indiana: HBM’s Second Competitive Curve Is Supply-Chain Localization
2+ week, 10+ hour ago (223+ words) The first “Made in USA” HBM will still begin with wafers fabricated in Korea. That is not a contradiction. It is a preview of how the AI semiconductor supply chain is being redesigned. The AI semiconductor boom is usually discussed…...
Why Nvidia May Spend $13bn on Hugging Face’s Doorway to AI Demand
2+ week, 1+ day ago (1495+ words) Nvidia has reportedly agreed to acquire Hugging Face for $12.9bn. Neither company has formally confirmed the transaction, so the deal may yet change or disappear. But the reported price is revealing. Hugging Face generates annualised revenue of roughly $150m. Nvidia would therefore…...
The ABF Squeeze: Why Cutting China’s Supply Will Not Fix the Shortage
2+ week, 6+ day ago (57+ words) AI chips are consuming more substrate material just as manufacturing yields are becoming harder to improve Note: This is only a rumor at this stage and has not been officially announced or confirmed. For substrate makers struggling to secure enough…...
HBF: As NAND Adopts an HBM-Like Architecture, the AI Memory Hierarchy Is Being Redefined
3+ week, 9+ hour ago (211+ words) A new direction is emerging in AI infrastructure in 2026: NAND flash is no longer being treated solely as storage inside SSDs. Instead, it is beginning to evolve toward a near-compute, high-bandwidth, high-capacity memory tier. One of the most representative technologies…...