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News


tspasemiconductor.substack.com > p > ai-data-centers-move-toward-800-vdc

AI Data Centers Move Toward 800 VDC: How SiC Circuit Protection Could Reshape the Semiconductor Supply Chain

11+ hour, 7+ min ago   (185+ words) tspasemiconductor.substack.com AI Data Centers Move Toward 800 VDC: How SiC Circuit Protection Could Reshape the Semiconductor Supply Chain Original Article By SemiVision Research [Reading time: 10 mins] The competition in AI infrastructure reaches beyond the accelerator. When a facility has limited…...


tspasemiconductor.substack.com > p > beyond-moores-law-the-rise-of-ai

Beyond Moore’s Law: The Rise of AI System Scaling :SEMICON Taiwan 2026 — From Advanced Packaging and CPO to Memory, Test, and Thermal Innovation

5+ day, 23+ hour ago   (357+ words) AI Semiconductors Enter the System Scaling Era: Advanced Packaging, CPO, HBM, FOPLP, and Testing Emerge as the Next Key Battlegrounds Based on SemiVision’s observations from the technical forums, industry discussions, and exhibition floor at SEMICON Taiwan 2026, the most important industry…...


tspasemiconductor.substack.com > p > from-one-gpu-to-an-ai-factory-deep

From One GPU to an AI Factory: Deep Dive into NVIDIA’s Six Hot Chips 2026 Presentations

6+ day, 10+ hour ago   (433+ words) If NVIDIA’s message at Hot Chips 2026 had to be summarized in one sentence, it would be this: the next phase of competition is no longer about who has the fastest GPU. It is about who can combine compute, memory, networking,…...


tspasemiconductor.substack.com > p > when-ai-chips-depend-on-a-bottle

When AI Chips Depend on a Bottle of Gas: How WF₆ Is Emerging as a New Bottleneck

1+ week, 1+ day ago   (175+ words) semivision When AI Chips Depend on a Bottle of Gas: How WF₆ Is Emerging as a New Bottleneck Oroginal Article By SemiVision Research [Reading time: 10 mins] The semiconductor supply constraints created by the AI boom are moving progressively upstream. Over the…...


tspasemiconductor.substack.com > p > hot-chips-2026-hbm-base-die-evolves

Hot Chips 2026: HBM Base Die Evolves from a Memory Interface into a Computing Engine — Samsung Unveils a Three-Phase Roadmap Toward Custom HBM, aHBM, and zHBM

1+ week, 1+ day ago   (326+ words) The AI era, however, is beginning to rewrite this division of responsibilities. The central idea Samsung introduced at Hot Chips 2026 is to apply advanced logic processes to the HBM Base Die, transforming the B-die from what has historically been a…...


tspasemiconductor.substack.com > p > why-nvidia-may-spend-13bn-on-hugging

Why Nvidia May Spend $13bn on Hugging Face’s Doorway to AI Demand

2+ week, 1+ day ago   (1495+ words) Nvidia has reportedly agreed to acquire Hugging Face for $12.9bn. Neither company has formally confirmed the transaction, so the deal may yet change or disappear. But the reported price is revealing. Hugging Face generates annualised revenue of roughly $150m. Nvidia would therefore…...


tspasemiconductor.substack.com > p > semivision-weekly-intelligence-2026-1fa

SemiVision Weekly Intelligence | 2026 August Week 4

2+ week, 2+ day ago   (111+ words) semivision SemiVision Weekly Intelligence | 2026 August Week 4 Original Article By SemiVision Research [Reading time: 7 mins] NVIDIA’s results confirm that the AI buildout is still accelerating, but the center of risk is moving downstream. Rubin rack production is pulling simultaneously on HBM,…...


tspasemiconductor.substack.com > p > diamond-rapids-is-not-just-a-256

Diamond Rapids Is Not Just a 256-Core CPU — Intel Is Turning Xeon Into a Chiplet System

2+ week, 5+ day ago   (183+ words) Intel’s Diamond Rapids presentation at Hot Chips 2026 looks, at first glance, like another server-CPU specification update. Up to 256 performance cores 1.28GB of last-level cache. Up to 1.6TB/s of memory bandwidth. 128 lanes of high-speed I/O. Intel 18A-P compute silicon. Those numbers matter,…...


tspasemiconductor.substack.com > p > hbf-as-nand-adopts-an-hbm-like-architecture

HBF: As NAND Adopts an HBM-Like Architecture, the AI Memory Hierarchy Is Being Redefined

3+ week, 9+ hour ago   (211+ words) A new direction is emerging in AI infrastructure in 2026: NAND flash is no longer being treated solely as storage inside SSDs. Instead, it is beginning to evolve toward a near-compute, high-bandwidth, high-capacity memory tier. One of the most representative technologies…...


tspasemiconductor.substack.com > p > amds-ai-architecture-evolution-from

AMD’s AI Architecture Evolution: From EPYC and Instinct to Helios and Heterogeneous Integration

3+ week, 13+ hour ago   (140+ words) We will share the following topics 1. Custom ASICs: Extending AMD Beyond General-Purpose CPUs and GPUs 2. EPYC’s Core Advantage Is Shifting from Core Count to Chiplet Architecture 3. Memory and I/O Are Becoming the Next EPYC Bottlenecks 4. CPU and GPU Architectures…...